同时兼容 169-FBGA 153-FBGA ,不同尺寸IC(11.5x13,12x16,12x18,14x18mm),可自行更换限位框实现通用性降低使用成本。

   ※ 采用日本进口双头探针，性能稳定使用寿命长，使用寿命是同类产品的10倍以上；

   ※ 维护方便，不良探针可更换，重复利用率较高，降低使用成本。

   ※ 兼容有球无球测试，通用性好，降低使用成本。

   ※ 采用手动翻盖式结构,操作方便简单。

We can do even 0.4pitch size

BGA(Ball Grid Array). A popular surface mount chip package that uses a grid of solder balls as its connectors. BGA chips are easier to align to the printed circuit board, because the leads, which are called "solder balls" or "solder bumps," are farther apart than leaded packages. Since the leads are underneath the chip, BGA has led the way to chip scale packaging (CSP) where the package is not more than 1.2x the size of the semiconductor